PhyLeave: Physical layer key based interleaving for secure wireless communication
Overview
Executive Statement:
A revolutionary approach to securing wireless communications through physical layer interleaving and encryption, significantly enhancing security with minimal overhead.
Description:
The technology introduces PhyLeave and PilotCrypt, innovative methods to secure wireless communications at the physical layer. By using a dynamic key-based interleaving system, these methods provide robust security measures that are difficult for adversaries to breach. PhyLeave focuses on the flexible interleaving of data to obfuscate packet transmissions, while PilotCrypt rearranges data-bearing and pilot tone sub-carriers in OFDM systems. Both techniques are designed to ensure security even when traditional software encryption keys are compromised, utilizing low hardware overhead and allowing rapid key updates.
Market Applications
- Secure wireless communications for Internet of Things (IoT) devices
- Enhanced security protocols for mobile and wireless communication networks
- Physical layer security solutions for critical infrastructure and military communications
- Low-cost, high-security communication methods for consumer electronics
Key Advantages
- Enhanced security at the physical layer, providing an additional barrier against adversaries
- Low hardware overhead, making it suitable for devices with limited processing capabilities
- Rapid key updates, allowing for flexible and dynamic security protocols
- Compatibility with existing OFDM systems, ensuring broad applicability
- Minimal impact on area overhead and clock frequency, preserving device performance
Problems Solved
- Increased vulnerability due to compromised software-based encryption keys
- High overhead and limited flexibility of traditional security methods
- Insufficient security measures at the physical layer of wireless communications
Intellectual Property
United States Issued Patent- Physical layer key based interleaving for secure wireless communication
Contact Information
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Inventor information